nichia sts-da1-2136 nichia corporation specifications for green led NHSG064t pb-free reflow soldering application built-in esd protection device rohs compliant
nichia sts-da1-2136 1 specifications (1) absolute maximum ratings item symbol absolute maximum rating unit forward current i f 15 ma pulse forward current i fp 30 ma allowable reverse current i r 85 ma power dissipation p d 53 mw operating temperature t opr -40~110 c storage temperature t stg -40~110 c junction temperature t j 125 c * absolute maximum ratings at t a =25c. * i fp conditions with pulse width 10ms and duty cycle 10%. (2) initial electrical/optical characteristics item symbol condition typ unit forward voltage v f i f =10ma 3.1 v luminous intensity i v i f =10ma 500 mcd x - i f =10ma 0.17 - chromaticity coordinate y - i f =10ma 0.70 - thermal resistance r js - 340 c/w thermal resistance r ja - 520 c/w * characteristics at t a =25c. * luminous intensity value as per cie 127:2007 standard. * chromaticity coordinates as per cie 1931 chromaticity chart. * r js is thermal resistance from junction to t s measuring point. * r ja is thermal resistance from junction to ambient test board: fr4 board thickness=1.6mm, copper layer thickness=35m .
nichia sts-da1-2136 2 ranks item rank min max unit forward voltage - 2.7 3.5 v t 560 780 s 390 560 luminous intensity r 280 390 mcd color ranks rank g rank h x 0.14 0.14 0.22 0.22 x 0.21 0.21 0.28 0.28 y 0.64 0.74 0.74 0.64 y 0.65 0.73 0.73 0.65 * ranking at t a =25c. * tolerance of measurements of the forward voltage is 3%. * tolerance of measurements of the luminous intensity is 10%. * tolerance of measurements of the chromaticity coordinate is 0.01. * a shipment shall consist of leds in a combination of the above ranks. the percentage of each rank in the shipment shall be determined by nichia.
nichia sts-da1-2136 3 chromaticity diagram h 535 540 550 555 545 g 0.55 0.60 0.65 0.70 0.75 0.80 0.10 0.15 0.20 0.25 0.30 0.35 x y
nichia sts-da1-2136 4 outline dimensions sts-da7-0430a nxsx064 ? no. ( g unit: mm) this product complies with rohs directive. u? rohs ?m??? * ( g unit: mm, tolerance: 0.2) ka o protection device (0.4) | weight ? item ??`| package materials ??| encapsulating resin materials ?O| electrodes materials description ????` heat-resistant polymer ?`? ( ?? silicone resin(with diffuser) ~? + y? ag-plated copper alloy 0.036g(typ) anode cathode (2.4) 2.8 (2.4) 3.2 cathode mark 20.3 2.2 (1.05) (0.45) (0.8) 3.50.3 (1.9) 0.80.3 0.80.3
nichia sts-da1-2136 5 soldering ? recommended reflow soldering condition(lead-free solder) ? recommended hand soldering condition temperature 350c max soldering time 3sec max recommended soldering pad pattern ( g unit: mm) 4 4 9.5 2.6 1.5 4 1.5 blank boxes: solder resist opening , shaded areas: footprint * this led is designed to be reflow soldered on to a pc b. if dip soldered, nichia cannot guarantee its reliability. * reflow soldering must not be performed more than twic e. hand soldering must not be performed more than once. * avoid rapid cooling. ramp down the temper ature gradually from th e peak temperature. * nitrogen reflow soldering is recommended. air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. pressure can cause nicks, chip-outs, encapsulant delaminati on and deformation, and wire br eaks, decreasing reliability. * repairing should not be done after the leds ha ve been soldered. when repairing is unavoidable, a double-head soldering iron should be used. it should be confirmed beforehand whether the characteri stics of the leds will or will not be damaged by repairing. * when soldering, do not apply stre ss to the led while the led is hot. 120sec max pre-heat 180 to 200c 260c max 10sec max 60sec max above 220c 1 to 5c per sec
nichia sts-da1-2136 6 tape and reel dimensions cathode mark -0 1 +0.25 2.85 0.1 sts-da7-0165 quantity per reel=2000pcs 1 `?? 2000 ? * nxxx064x 0.25 0.05 2.15 0.1 3.65 0.1 ?` / ` trailer and leader top cover tape led ?? ` 400mm ?` 160mm ? trailer 160mm min(empty pockets) loaded pockets ???` embossed carrier tape ???`?` feed direction leader without top cover tape 400mm min 100mm ? leader with top cover tape 100mm min(empty pocket) the tape packing method complies with jis c 0806 (packaging of electronic components on continuous tapes). * jis c 0806 ???`??????? ? no. ( g unit: mm) 60 +1 -0 `? reel f 1 3 0 . 2 f 2 1 0 . 8 ? label 2 1 0 . 8 1 3 0 . 2 11.4 1 9 0.3 180 +0 -3 -0 1.5 +0.1 ?`??? tape 4 0.1 1.75 0.1 4 0.1 2 0.05 3.5 0.05 8 +0.3 -0.1
nichia sts-da1-2136 7 packaging - tape & reel nichia led sts-da7-0006b nxxxxxxx ? label ? label ? no. reel ` ?` seal moisture-proof bag ?? ? for details, see "lot numbering scheme" in this document. * ??????????? if not provided, it is not indicated on the label. ******* is the customer part number. O??????? * ******* ?? the label does not have the rank field for un-ranked products. * ??????????? rohs nxxxxxxx xxxx led ******* nichia corporation 491 oka, kaminaka, anan, tokushima, japan type lot qty. ymxxxx-rrr pcs rohs nxxxxxxx xxxx led ******* rrr pcs type rank qty. nichia corporation 491 oka, kaminaka, anan, tokushima, japan reels are shipped with desiccants in heat-seale d moisture-proof bags. ????`??????`???? desiccants ? products shipped on tape and reel are packed in a moisture-proof bag. they are shipped in cardboard boxes to protect th em from external forces during transportation. ??\H?y?B???y? * ?`???????y?????? * ?QH??n?????u?p?????? * * u???`?????n?go??`y? using an original packaging material or equivalent in transit is recommended. do not expose to water, the box is not water-resistant. do not drop or shock the box. it may damage the products. moisture-proof bags are packed in cardboard boxes with corrugated partitions. ??K???`?
nichia sts-da1-2136 8 lot numbering scheme lot number is presented by using the following alphanumeric code. ymxxxx - rrr y - year year y 2009 9 2010 a 2011 b 2012 c 2013 d 2014 e m - month month m month m 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 a 5 5 11 b 6 6 12 c xxxx-nichia's product number rrr-ranking by color coordinates, ranking by luminous intensity
nichia sts-da1-2136 9 derating characteristics nhsx064 sts-da7-1279a ? no. derating1 0 5 10 15 20 25 0 2040 6080100120 (85, 15.0) (1 10, 6 .00 ) dut y 1 10 100 110100 15 3 0 S all owa bl e f orwar d c urr ent ( m a) ??-S ambient temperature vs allowable forward current S allowable forward current(ma) ?? ambient temperature(c) ?` ?` duty ratio(%) ?`?`-S duty ratio vs allowable forward current t a = 25c
nichia sts-da1-2136 10 optical characteristics NHSG064 ? no. sts-da7-2001 spectrum 0.0 0.2 0.4 0.6 0.8 1.0 400 450 500 550 6 00 650 7 00 relative l umin osity( a.u .) directivity1 90 80 70 60 50 40 30 20 10 0 -10 -2 0 -30 -4 0 -50 -6 0 -7 0 -80 -9 0 k??? spectrum k? relative emission intensity(a.u.) L wavelength(nm) ? directivity ? radiation angle 10.500.5 1 10ma i f = t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. 10 ma i fp = t a =25c
nichia sts-da1-2136 11 forward current characteristics / temperature characteristics NHSG064h sts-da7-2002 ? no. tavf 2.0 2.5 3.0 3.5 4.0 -60 -40 -20 0 20 40 60 80 100 1 20 ta iv 0.6 0.8 1.0 1.2 1.4 -60 -40 -2 0 0 20 40 6 0 80 100 120 vfif 1 10 100 2.0 2.5 3.0 3.5 4.0 30 relative luminosity(a.u.) ??- ambient temperature vs relative luminosity for ward curren t( m a) ifiv 0.0 0.5 1.0 1.5 2.0 2.5 3.0 010203040 relative luminosity(a.u.) - forward current vs relative luminosity forw ard current(ma) ?R- forward voltage vs forward current ??-?R ambient temperature vs forward voltage ?R forward volta g e(v) ?R forward voltage(v) ?? ambient tem p erature ( c ) ?? ambient temperature(c) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c i fp = 10ma i fp = 10ma
nichia sts-da1-2136 12 forward current characteristics / temperature characteristics ? no. NHSG064 sts-da7-2003 if d 51 0 51 5 52 0 52 5 53 0 53 5 54 0 110100 ta d 510 515 520 525 530 535 540 -6 0 -40 -20 0 2 0 40 60 80 100 12 0 10ma i fp = -L forward current vs dominant wavelength forwar d current(ma) ??-L ambient temperature vs dominant wavelength dominant wavelength(nm) L dominant wavelength(nm) L ?? ambient temperature(c) ifxy 0.55 0.60 0.65 0.70 0.75 0.80 0.05 0.10 0.15 0.20 0.25 0.30 1 ma(531n m) 5 ma(528n m) 10ma(5 25nm) 15 ma(523nm) 30 ma(519n m) x y -?(L) forward current vs chromaticity coordinate( d) t a =25c * ??? all characteristics shown are for reference only and are not guaranteed. t a =25c
nichia sts-da1-2136 13 reliability (1) tests and results te s t reference standard test conditions te s t duration failure criteria # units failed/tested resistance to soldering heat (reflow soldering) jeita ed-4701 300 301 t sld =260c, 10sec, 2reflows, precondition: 30c, 70%rh, 168hr #1 0/22 solderability (reflow soldering) jeita ed-4701 303 303a t sld =2455c, 5sec, lead-free solder(sn-3.0ag-0.5cu) #3 0/22 thermal shock jeita ed-4701 300 307 -40c to 110c, 1min dwell, 10sec transfer, precondition: 30c, 70%rh, 168hr 100cycles #1 0/100 temperature cycle jeita ed-4701 100 105 -40c(30min)~25c(5min)~ 110c(30min)~25c(5min) 100cycles #1 0/100 moisture resistance (cyclic) jeita ed-4701 200 203 25c~65c~-10c, 90%rh, 24hr per cycle 10cycles #1 0/100 high temperature storage jeita ed-4701 200 201 t a =110c 1000hours #1 0/100 temperature humidity storage jeita ed-4701 100 103 t a =60c, rh=90% 1000hours #1 0/100 low temperature storage jeita ed-4701 200 202 t a =-40c 1000hours #1 0/100 room temperature operating life t a =25c, i f =15ma 1000hours #2 0/100 high temperature operating life t a =85c, i f =15ma 1000hours #2 0/100 temperature humidity operating life 60c, rh=90%, i f =10ma 1000hours #2 0/100 low temperature operating life t a =-40c, i f =10ma 1000hours #2 0/100 permanence of marking jeita ed-4701 500 501 isopropyl alcohol, 235c, dipping time: 5min 1time #1 0/22 vibration jeita ed-4701 400 403 200m/s 2 , 100~2000~100hz, 4cycles, 4min, each x, y, z 48minutes #1 0/10 free fall 3drops from a height of 75cm #1 0/10 electrostatic discharges jeita ed-4701 300 304 hbm, 2kv, 1.5k ? , 100pf, 3pulses, alternately positi ve or negative #1 0/22 notes: measurements are performed after allowi ng the leds to return to room temperature. (2) failure criteria criteria # items conditions failure criteria forward voltage(v f ) i f =10ma >u.s.l.1.1 #1 luminous intensity(i v ) i f =10ma u.s.l.1.1 #2 luminous intensity(i v ) i f =10ma nichia sts-da1-2136 14 cautions (1) storage conditions temperature humidity time before opening aluminum bag 30c 90%rh within 1 year from delivery date storage after opening aluminum bag 30c 70%rh 168hours baking 655c - 24hours product complies with jedec msl 3 or equivalent. se e ipc/jedec std-020 for moisture-sensitivity details. absorbed moisture in led packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. products are packed in moisture-proof aluminum bags to minimize moisture absorptio n during transportation and storage. included silica gel desiccants change from blue to red if moisture had penetrated bags. after opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. unused remaining leds should be stored with silica gel desiccants in a hermetically sealed container, prefer ably the original moisture -proof bags for storage. after the ?period after opening? stor age time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. baking should only be done once. customer is advised to keep the leds in an airtight cont ainer when not in use. exposu re to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect so ldering and optical characteristi cs. it is also recommended to return the leds to the original moisture proof bags and reseal. after assembly and during use, silver plating can be affected by the corrosi ve gases emitted by components and materials in close proximity of the leds within an end product, and the gases entering into the product from the external atmosphere. the above should be taken into consideration when designing. resin materials, in particular, may contain substanc es which can affect silver plating, such as halogen. do not use sulfur-containing materials in commercial products. some materials, such as seals and adhesives, may contain sulfur . the extremely corroded or contaminated plating of leds might cause an open ci rcuit. silicone rubber is recommended as a material for seals. bear in mi nd, the use of silicones may lead to silico ne contamination of electrical contacts inside the products, caused by lo w molecular weight volatile siloxane. to prevent water condensation, please avoid large temperat ure and humidity fluctuations for the storage conditions. (2) directions for use when designing a circuit, the current through each led must not exceed the absolute maximum rating. operating at a constant current per led is recommended. in case of operating at a constant voltage, circuit b is recommended . if the leds are operated with constant voltage using circui t a, the current through the leds may vary due to the variation in forward voltage ch aracteristics of the leds. (a) ... (b) ... leds should be operated in forward bias. driving circuits must not subject leds to either forward or reverse voltage while off . continuous reverse voltage can cause migration and led damage. for stabilizing the led characteristics, it is recommended to operate at greater than 10% nominal current. for outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. (3) handling precautions do not handle leds with bare hands, it may contaminate the led surface and affect optical characteristics. in the worst case, catastrophic failure from excess pres sure through wire-bond breaks and package damage may result. when handling the product with tweezers, be careful not to apply excessive force to the resin. otherwise, the resin can be cut, ch ipped, delaminate or deform ed, causing wire-bond breaks and catastrophic failures. dropping the produc t may cause damage. do not stack assembled pcbs together. fa ilure to comply can cause the resin portio n of the product to be cut, chipped, delaminated and/or deformed. it may cause wi re to break, leading to catastrophic failures.
nichia sts-da1-2136 15 (4) design consideration pcb warpage after mounting the products on to a pcb can cause the package to break. the led should be placed in a way to minimize the stress on the leds due to pcb bow and twist. the position and orientation of the leds affect how much mechan ical stress is exerted on the leds placed near the score lines. the led should be placed in a way to minimize the stress on the leds due to board flexing. board separation must be performed using special jigs, not using hands. (5) electrostatic discharge (esd) the products are sensitive to static electricity or surge voltage. esd can damage a die and its reliability. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wriststrap, es d footwear, clothes, and floors grounded workstation equipment and tools esd table/shelf mat made of conductive materials proper grounding is required for all devices, equipment, and machinery used in product assembly. surge protection should be considered when design ing of commercial products. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electros tatic discharge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers the customer is advised to chec k if the leds are damaged by esd when performing the characteristics inspection of the leds in the application. damage can be detected with a forward voltag e measurement or a light-up test at low current ( 1ma). esd damaged leds may have current flow at a low voltage or no longer illuminate at a low current. failure criteria: v f <2.0v at i f =0.5ma (6) thermal management proper thermal management is an impo rtant when designing produc ts with leds. led die temperature is affected by pcb thermal resistance and led spacing on the board. please design products in a way that the led die temperature does not exceed the maximum junction temperature (t j ). drive current should be determined for the surrounding ambient temperature (t a ) to dissipate the heat from the product. (7) cleaning if required, isopropyl alcohol (ipa) should be used. ot her solvents may cause premature failure to the leds due to the damage to the resin portion. the effects of such solvents should be verified prior to use. in addition, the use of cfcs such as freon is heavily regulated. ultrasonic cleaning is not recommended since it may have adverse effects on the leds depending on the ultrasonic power and how led is assembled. if ultrasonic cleaning must be used, the customer is advise d to make sure the leds will not be damaged prior to cleaning. (8) eye safety in 2006, the international electrical commission (iec ) published iec 62471:2006 photobiological safety of lamps and lamp systems, which added leds in its scope. on the other hand, the iec 60825-1:2007 laser safety standard removed leds from its scope. however, please be advised that some countries and regions have adopted standards based on the iec laser safety standard iec 60825- 1:20112001, which still includes leds in its scope. most of nichia's leds can be classified as belo nging into either the exempt group or risk group 1. high-power leds, that emit light containing blue wavelengths, may be classified as risk group 2. please proceed with caution when viewing directly any leds driven at high current, or viewing leds with optical instruments which may greatly increase the damages to your eyes. viewing a flashing light may cause eye discomfort. when incorporating the led into your product, please be careful to avoid adverse effects on the human body caused by light stimulation.
nichia sts-da1-2136 16 (9) others the leds described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). consult nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as for airplanes, aerospace, submersibl e repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). the customer shall not reverse engineer by disassembling or analysis of the leds without having prior written consent from nichia. when defective leds are found, the customer shall inform nichia directly before disassembling or analysis. both the customers and nichia will agree on official specificat ions of supplied products before a customer's volume production . specifications and appearance subject to change for improvement without notice.
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